It’s earlier revealed that the Xiaomi Mi 7 could come with the Qualcomm’s latest flagship SoC, the Snapdragon 845. In fact, the Mi 7, which is set to be official in early 2018. It might be the first to flaunt the SD 845 Mobile Platform. Similarly, it seems the Sony too has a plan to launch a flagship powered by the same on next year beginning. Since a latest Benchmark data plausibly hints a Qualcomm Snapdragon 845 powered Sony device.
The supposed Sony flagship bearing model number H8266, has recently spotted on GeekBench bagging CPU scores similar to the upcoming Galaxy S9/S9+, which also does possess the SD 845 at its heart. Hence, the chances of Sony flagship with the latest Mobile Platform is high and considerable.
Moreover, the benchmarking also reveals a 4GB RAM for the device. And, it’s expected to come with Android Oreo pre-installed. Of course, the device will be eligible for Google’s new Project Treble implementation, if the data comes out to be true.
Well, unlike this year’s Galaxy S8/S8+, the upcoming Samsung Galaxy S9/S9+ ought to have a real competition from its alikes. Since, the 2018 beginning could witness various OEM’s to launch their flagships with latest SoC as early as possible. Seems the Samsung’s strategy of sourcing initial batches of Qualcomm chipsets won’t work next year. Anyway, let us see who’ll be ruling the flagship segment on upcoming business year.